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We’re pleased to welcome back Lee Smith, Lead Software Engineer at Mettler-Toledo and Co-Chairman of the OMAC Packaging Workgroup for his second guest blog.
Following the recent announcement that Lee Smith, Lead Software Engineer at Mettler-Toledo, has been appointed Co-Chairman of the OMAC Packaging Workgroup, we’re pleased to welcome Lee for his first guest blog…
You may recall me blogging in August last year about the importance of conducting regular performance verification tests to ensure inspection devices continue to perform as intended.
We’ll now have a detailed look at precisely what comprises that failsafe system – and what its essential components should be.
In this first of a two-part blog, we consider the importance of the ‘Due Diligence’ principle in quality control – and the need to establish safety systems to protect both manufacturers and end consumers.