Interpack Day One
Get the Inside Scoop from an Industry Expert!
As the world’s leading packaging fair opens its doors for the first day in Düsseldorf, Germany, today we’re excited to reveal that Mettler-Toledo Product Inspection will be hosting a series of Expert Roundtables.
Visitors to our booth (Stand B55 in Hall 11) will have the opportunity to hear four product inspection experts discuss a different industry pain point/hot topic at 10.30am every weekday from 4-10 May 2017.
Talks will last between 20-30 minutes and afterwards there will be a chance for audience members to ask questions.
Today, Mike Bradley, Head of Sales at Safeline-UK, will speak about “The Correct Procedures for Testing Metal Detection Equipment”. Regular testing of metal detection equipment is an essential part of any well-designed quality management system in the food or pharmaceutical industry to verify compliance with ISO certification requirements, country-specific retailer codes of practice, Hazard Analysis and Critical Control Points (HACCP) and Good Manufacturing Practice (GMP) standards.
Discover the Benefits of PackML
Tomorrow’s (Friday’s) speaker Lee Smith, Lead Software Engineer at Mettler-Toledo and Co-Chairman of OMAC Packaging Workgroup, will share Mettler-Toledo’s experiences of implementing PackML on our range of product inspection devices. Lee will demonstrate how the combination of PackML with other industrial standard communication protocols provides a complete integration/connectivity solution for customers.
Listen to experts from TÜV NORD and IFS on our stand next week!
Subscribe and Win
Subscribe to this blog during interpack and you’ll be entered into a prize draw to win a pair of SONY noise cancellation wireless headphones!
We’d love your feedback: please leave a review below…