• Intepack
    • 05 MAY 17

    Day two at Interpack

    It was fantastic to have so many visitors to our booth (Stand B55 in Hall 11) at interpack yesterday!

    And we’re looking forward to meeting many more of you in Düsseldorf, Germany over the next few days.

    Watch this video to hear Birger Becker, Head of Marketing, Service and Market Management PI Division, reveal why Mettler-Toledo Product Inspection attends the world’s leading packaging fair, how this year’s stand is set up with four operational lines, and why you simply can’t afford to miss us.

    Today’s Talk

    Lee Smith, Lead Software Engineer at Mettler-Toledo and Co-Chairman of OMAC Packaging Workgroup, discussed Mettler-Toledo’s experiences of implementing PackML on our range of product inspection devices at 10.30am today.

    Lee demonstrated how the combination of PackML with other industrial standard communication protocols offers a complete integration/connectivity solution for customers.

    Afterwards there was an opportunity to ask Lee questions and talk to him directly. Lee will be on the stand for the rest of the day, so pop by to ask him further questions

    Sign Up to Win

    Subscribe to this blog during interpack and you’ll be entered into a prize draw to win a pair of SONY noise cancellation wireless headphones!

    We value your feedback: please leave a review here…


    Leave a reply →

Leave a Reply

Your email address will not be published. Required fields are marked *